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| PRELIMINARY * PERFORMANCE (1.8 GHz) 33 dBm Linear Output Power 14.5 dB Power Gain Useable Gain to 10 GHz 44 dBm Output IP3 20 dB Maximum Stable Gain 45% Power-Added Efficiency 10V Operation / Plated Source Thru-Vias DRAIN BOND PAD (2X) FPD2000V 2W POWER PHEMT GATE BOND PAD (2X) * DESCRIPTION AND APPLICATIONS DIE SIZE (m): 650 x 800 DIE THICKNESS: 75m BONDING PADS (m): >70 x 70 The FPD2000V is a discrete depletion mode AlGaAs/InGaAs pseudomorphic High Electron Mobility Transistor (pHEMT), optimized for power applications in L- and C-Bands. The FPD2000V includes Source plated thru-vias, and does not require wire bonds to the Source. Typical applications include drivers or output stages in PCS/Cellular base station transmitter amplifiers, as well as other power applications in WLL/WLAN amplifiers. * ELECTRICAL SPECIFICATIONS AT 22C Parameter Power at 1dB Gain Compression Power Gain at dB Gain Compression Maximum Stable Gain S21/S12 Power-Added Efficiency at 1dB Gain Compression 3 -Order Intermodulation Distortion S and L tuned for Optimum IP3 Saturated Drain-Source Current Maximum Drain-Source Current Transconductance Gate-Source Leakage Current Pinch-Off Voltage Gate-Source Breakdown Voltage Gate-Drain Breakdown Voltage Thermal Resistivity IDSS IMAX GM IGSO |VP| |VBDGS| |VBDGD| CC rd Symbol P1dB G1dB MSG PAE IM3 Test Conditions VDS = 10V; IDS = 350 mA S and L tuned for Optimum IP3 VDS = 10V; IDS = 350 mA S and L tuned for Optimum IP3 VDS = 10 V; IDS = 350mA PIN = 0dBm, 50 system VDS = 10V; IDS = 350 mA S and L tuned for Optimum IP3 VDS = 10V; IDS = 350 mA POUT = 22 dBm (single-tone level) VDS = 1.3 V; VGS = 0 V VDS = 1.3 V; VGS +1 V VDS = 1.3 V; VGS = 0 V VGS = -3 V VDS = 1.3 V; IDS = 4 mA IGS = 4 mA IGD = 4 mA See Note on following page Min 32 13.0 Typ 33 14.5 20 45 Max Units dBm RF SPECIFICATIONS MEASURED AT f = 1.8 GHz USING CW SIGNAL dB % -46 975 1150 1800 1200 35 0.7 6 20 0.9 8 22 18 85 1.4 1375 dBc mA mA mS A V V V C/W Phone: +1 408 850-5790 Fax: +1 408 850-5766 http://www.filtronic.co.uk/semis Revised: 4/29/05 Email: sales@filcsi.com PRELIMINARY FPD2000V 2W POWER PHEMT * RECOMMENDED OPERATING BIAS CONDITIONS Drain-Source Voltage: From 5V to 10V Quiescent Current: From 25% IDSS to 55% IDSS ABSOLUTE MAXIMUM RATINGS1 Parameter Drain-Source Voltage Gate-Source Voltage Drain-Source Current Gate Current RF Input Power 2 * Symbol VDS VGS IDS IG PIN TCH TSTG PTOT Comp. 3 2 Test Conditions -3V < VGS < +0V 0V < VDS < +8V For VDS > 2V Forward or reverse current Under any acceptable bias state Under any acceptable bias state Non-Operating Storage See De-Rating Note below Under any bias conditions 2 or more Max. Limits Min Max 12 -3 IDSS +15/-2 900 175 Units V V mA mA mW C C W dB % Channel Operating Temperature Storage Temperature Total Power Dissipation Gain Compression Simultaneous Combination of Limits 1 3 -40 150 8.5 5 80 Users should avoid exceeding 80% of 2 or more Limits simultaneously TAmbient = 22C unless otherwise noted Max. RF Input Limit must be further limited if input VSWR > 2.5:1 Notes: * Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. * Thermal Resitivity specification assumes a Au/Sn eutectic die attach onto a Au-plated copper heatsink or rib. * Power Dissipation defined as: PTOT (PDC + PIN) - POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power * Absolute Maximum Power Dissipation to be de-rated as follows above 22C: PTOT= 8.5W - (0.056W/C) x THS where THS = heatsink or ambient temperature above 22C Example: For a 85C heatsink temperature: PTOT = 8.5W - (0.056 x (85 - 22)) = 4.9W * HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. This product has be tested to Class 1A (> 250V but < 500V) using JESD22 A114, Human Body Model, and to Class A, (< 200V) using JESD22 A115, Machine Model.. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is one minute. The recommended wire bond method is thermo-compression wedge bonding with 1.0 mil (0.025 mm) gold wire. Stage temperature should be 250-260C. http://www.filtronic.co.uk/semis Revised: 4/29/05 Email: sales@filcsi.com * Phone: +1 408 850-5790 Fax: +1 408 850-5766 PRELIMINARY * FPD2000V 2W POWER PHEMT APPLICATIONS NOTES & DESIGN DATA Applications Notes are available from your local Filtronic Sales Representative or directly from the factory. Complete design data, including S-parameters, noise data, and large-signal models are available on the Filtronic web site. * BONDING DIAGRAM Note: 25 m (0.001 in.) gold wire is recommended. No Source wire bonds are needed, device features Source thru-vias. All information and specifications are subject to change without notice. Phone: +1 408 850-5790 Fax: +1 408 850-5766 http://www.filtronic.co.uk/semis Revised: 4/29/05 Email: sales@filcsi.com |
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